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LDI laser digital imaging technology, data files are directly read by DPX, converted into images, and laser beams are transmitted to plates through DMD and lens, which are applied to carrier board, soft board, HDI board, multi-layer PCB, fine analytical quality, optimized technology, and efficient industry solution.
Precise resolution:
Data resolution can achieve 0.35um
Minimum line width/ line spacing 6um
(based on configuration )
Dry film thickness:
Can exposure 500um dry film thickness
Multiple options for scale, higher
alignment accuracy:
Auto scale/ Fixed scale/ Measurement:
scale function
Inner layer overlay 10um
Outer layer alignment ±5um
Green/ Blue/ Black/ Red/ White ink(optional) .
Solder mask ink 5.5 pnl/min(two machine in-line)
Auto scale/ Fixed scale/Measurement scale function. Outer layer alignment accuracy±12um.
